Microbridgetech

The Rejustor™ Company

 

Competitive Comparisons

Choose an item below to learn more...

Analog pots (Manual Mechanical Trimpots)

Analog pots Limitations
  • Cost (0.10$ to several dollars per unit in volume depending on adjustment resolution)
  • Large form factors
  • Limited adjustment accuracy (5-1%) and poor matching
  • Prone to drift under vibration and temperature
  • Require manual adjustment
  • Limited high-frequency range (inevitable inductance)
Microbridge Rejustors vs. Analog pots
  • Competitive cost for dual Rejustors in volume
  • Small form factors (SO & QFN packages)
  • Superior adjustment accuracy and matching (0.1% or better)
  • Improve precision and reliability under vibrating conditions (<0.01% change with vibration)
  • Temperature compensation possible
  • Eliminate manual or mechanical operation
  • Higher frequencies (~1GHz or higher)

Digital pots (Configurable Resistor Arrays)

Limitations of Digital pots (Configurable Resistor Arrays) 
  • Cost (0.50-3.00$ per unit in volume depending on # of bits of resolution)
  • Adjustment accuracy depends on # of bits of resolution (7bits=~0.8%, 10bits=~0.1%) - discrete adjustment
  • Not passive components
  • Limited resistance values (typically 10Kohm or higher) due to wiper resistance
  • Limited high-frequency range (~1MHz)
  • Dissipates power (needed for normal operation)
  • Requires non-volatile technology to maintain settings (e.g. E2PROM) with potential associated reliability issues
Microbridge Rejustors vs. Digital pots
  • Competitive cost for dual Rejustors in volume
  • Superior adjustment accuracy (0.1% or better)
  • True passive operation
  • Wide range of resistance values possible (no 'wiper' Resistance)
  • Higher frequencies (~1GHz or higher)
  • Low power (no power required during operation, only 2-5V, 2-5mA during trimming)
  • Rejustors are a non-volatile device
  • Smaller layout footprint versus DPOT when integrated on chip
  • Potential for multi-order temperature compensation

Digital Conditioning

Limitations of Sensor/Signal Conditioning
  • Cost (0.50-3.00$ per unit in volume depending on accuracy)
  • Adjustment accuracy depends on # of bits of resolution used - discrete compensation fit
  • Not passive components
  • Complex configuration by users required
  • Dissipates power (needed for normal operation)
  • Requires non-volatile technology to maintain settings (e.g. E2PROM) with potential associated reliability issues
Microbridge Rejustors vs. Sensor/Signal Conditioning
  • Competitive cost for dual Rejustors in volume
  • Offers precision offset and gain adjustment and temperature compensation as part of pre-conditioning solution
  • Potential for multi-order temperature compensation
  • Can compensate for sensor aging and drift at the source
  • Low power (no power required during operation, only 2-5V, 2-5mA during trimming)
  • Rejustors are a non-volatile device
  • Smaller layout footprint when integrated with semiconductor sensor
  • Complementary with and can be added to current sensor/signal conditioning to improve performance and yield

Laser Trimming (Thick Film - Hybrid)

Limitations of Laser Trimming (Thick Film - Hybrid)
  • Trimmed in one direction only
  • One time adjustment, typically before final assembly
  • Limited trim adjustment accuracy (1-0.5%)
  • Technology experience required
  • Manually intensive setup
  • Expensive capital investment ($200K/laser)
  • Can only trim one resistor at a time
  • Resistor must be large enough for laser alignment and trim to desired tolerance
Microbridge Rejustors vs. Laser Trimming (Thick Film - Hybrid)
  • Offers adjustability in both directions
  • Multiple adjustments before or after assembly
  • Superior adjustment accuracy (0.1% or better)
  • Networks of resistors and Rejustors possible
  • Temperature compensation possible
  • Possibility of user-initiated adjustment
  • Automated adjustment with standard test equipment, no lasers
  • Can trim multiple devices simultaneously
  • Trim at temperature as part of production test
  • Low TCR material (0±100ppm/oK)
  • Small form factor (die SO & SOT packages) suitable for hybrid assembly

Laser Trimming (Thin Film – integrated circuit)

Limitations of Laser Trimming (Thin Film – integrated circuit)
  • Trimmed in one direction
  • One time adjustment before packaging
  • May change during final packaging
  • Technology experience required
  • Manually intensive setup of wafers
  • Expensive capital investment ($0.5-1M/laser)
  • Can only trim one resistor at a time
  • Resistor must be large enough for laser alignment and trim to desired tolerance
Microbridge Rejustors vs. Laser Trimming (Thin Film – integrated circuit)
  • Offers adjustability in both directions
  • Multiple adjustments before or after packaging
  • Superior adjustment accuracy (0.1% or better)
  • Temperature compensation possible
  • Possibility of user-initiated adjustment
  • Automated adjustment with standard IC test equipment, no lasers
  • Can trim multiple devices simultaneously
  • Different TCR materials possible (+, -, zero)
  • Similar in size to laser trimmable resistor

Fusible Passive Resistor Arrays

Limitations of Fusible Passive Resistor Arrays
  • Not used for precision
  • Trim adjustment accuracy depends on # of resistors and fuses - discrete adjustment
  • Generally trim only in one direction
  • One time adjustment
  • High power to ‘blow' fuse
  • Potential reliability issues
  • Potential large unused layout footprint
Microbridge Rejustors vs. Fusible Passive Resistor Arrays
  • Superior adjustment accuracy (0.1% or better)
  • Bi-directional adjustability with chip level voltage and current (2-5V, 2-5mA to adjust)
  • Multiple adjustments before or after packaging
  • Possibility of user-initiated adjustment
  • Small form factor (similar in size to poly or thin film micro-resistor)
  • Temperature compensation possible